REFLOW SOLDERING BY HOT GAS HEATING.

被引：0
|
作者：
Figliozzi, John J.
机构：
来源：
Insulation/Circuits | 1975年 / 21卷 / 06期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
All aspects of hot-gas soldering in circuitry applications are described and illustrated. Criteria of quality control, and advantages of method are listed.
引用
收藏
页码：30 / 32
相关论文
共 50 条
  • [1] THE RELIABILITY OF REFLOW SOLDERING BY HOT AIR REFLOW
    KOJIMA, Y
    KIKUCHI, M
    MATSUNAGA, K
    YAMAZAKI, N
    SEVENTH IEEE/CHMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM: INTEGRATION OF THE MANUFACTURING FLOW - FROM RAW MATERIAL THROUGH SYSTEMS-LEVEL ASSEMBLY, 1989, : 43 - 47
  • [2] HOT ON HEATING.
    Chynoweth, Emma
    Process Engineering (London), 1987, 68 (10):
  • [3] Reflow Oven for Heating and Soldering SMD and BGA Components
    Pawlowski, Pawel
    Dabrowski, Adam
    Grenz, Marcin
    Bladowski, Michal
    PROCEEDINGS OF THE 25TH INTERNATIONAL CONFERENCE MIXED DESIGN OF INTEGRATED CIRCUITS AND SYSTEM (MIXDES 2018), 2018, : 324 - 329
  • [4] Optimization of a reflow soldering process based on the heating factor
    Gao, JinGang
    Wu, YiPing
    Ding, Han
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2007, 19 (01) : 28 - 33
  • [5] HOSPITAL SERVICE HOT WATER HEATING.
    Gritschke, Robert O.
    HPAC Heating, Piping, Air Conditioning, 1985, 57 (10): : 47 - 51
  • [6] Isothermic room with gas heating.
    Hoffmann, G
    PHYSIKALISCHE ZEITSCHRIFT, 1917, 18 : 321 - 322
  • [7] Saving Oil and Gas in Industry and Heating.
    Rojey, A.
    Revue de l'Energie, 1981, 32 (333): : 157 - 164
  • [8] On Reflow Soldering Process and Reflow Profile
    Gui, Xulong
    Zhang, Zongyang
    Xu, Ling
    Liu, Sheng
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 865 - 870
  • [9] THERMAL DIFFUSIVITY OF COKE IN THE HOT STATE AND ON SECONDARY HEATING.
    Filonenko, Yu.Ya.
    Ovchinnikova, L.V.
    Solid Fuel Chemistry, 1984, 18 (05) : 112 - 114
  • [10] UNRAVELING THE MYSTERIES - HOT BAR REFLOW SOLDERING OF SURFACE MOUNT TECHNOLOGY
    WOERNER, K
    PROCEEDING OF THE TECHNICAL PROGRAM OF NEPCON WEST 89, VOLS 1 AND 2, 1989, : 998 - 1013
12345