REFLOW SOLDERING BY HOT GAS HEATING.

被引：0
|
作者：
Figliozzi, John J.
机构：
来源：
Insulation/Circuits | 1975年 / 21卷 / 06期
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学科分类号：
摘要：
All aspects of hot-gas soldering in circuitry applications are described and illustrated. Criteria of quality control, and advantages of method are listed.
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页码：30 / 32
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