Reflow Oven for Heating and Soldering SMD and BGA Components

被引：0

作者：

Pawlowski, Pawel ^{[1
]}

Dabrowski, Adam ^{[1
]}

Grenz, Marcin ^{[2
]}

Bladowski, Michal ^{[2
]}

机构：

[1] Poznan Univ Tech, Div Signal Proc & Elect Syst, Poznan, Poland

[2] PRO SERV COM Sp Zoo, Bydgoszcz, Poland

来源：

PROCEEDINGS OF THE 25TH INTERNATIONAL CONFERENCE MIXED DESIGN OF INTEGRATED CIRCUITS AND SYSTEM (MIXDES 2018) | 2018年

关键词：

reflow oven; soldering; surface mounted devices; ball grid arrays; components;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents a design and realization of a universal reflow oven for both healing and soldering of MID components, including reboiling of BCA packages. The reflow oven is composed of two blocks in separate housings: a control system and a hearing system. The control system was built with the Siemens SIMATIC S7-1200 PLC (programmable logic controller) with additional modules. The heating system consists of a three-zoned thermally isolated heating chamber with an original upper inspection window. Some original solutions were proposed, which significantly facilitated operation of the device. Tests of the reflow oven confirmed relevance of the design assumptions and high quality of the product.

引用

页码：324 / 329

页数：6

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