Monitoring adhesive joints using piezoelectric polymer film

被引：0
|
作者：
Anderson, Gregory L. [1 ]
Mommaerts, Joseph [1 ]
Tang, Shiu L. [1 ]
Duke, John C. [1 ]
Dillard, David A. [1 ]
机构：
[1] Thiokol Corp, Brigham, United States
来源：
Journal of Intelligent Material Systems and Structures | 1993年 / 4卷 / 03期
关键词：
Adhesive cure monitoring - Adhesive joint monitoring - Cyclic bond normal stresses - Piezoelectric polymer films - Polyvinylidene fluorides;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：425 / 428
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