Yield prediction for flip-chip solder assemblies based on solder shape modeling

被引：0
|
作者：
Tower, Susan C. [1 ]
Su, Bingzhi [2 ]
Lee, Y.C. [2 ]
机构：
[1] Picolight Incorporated, Boulder, CO 80301, United States
[2] Mechanical Engineering Department, University of Colorado, Boulder, CO 80309, United States
来源：
IEEE Transactions on Electronics Packaging Manufacturing | 1999年 / 22卷 / 01期
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页码：29 / 37
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