Yield prediction for flip-chip solder assemblies based on solder shape modeling

被引：0
|
作者：
Tower, Susan C. [1 ]
Su, Bingzhi [2 ]
Lee, Y.C. [2 ]
机构：
[1] Picolight Incorporated, Boulder, CO 80301, United States
[2] Mechanical Engineering Department, University of Colorado, Boulder, CO 80309, United States
来源：
IEEE Transactions on Electronics Packaging Manufacturing | 1999年 / 22卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：29 / 37
相关论文
共 50 条
  • [1] Prediction of yield for flip-chip solder assemblies
    Tower, S
    Si, BZ
    Lee, YC
    1998 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES AND HIGH DENSITY PACKAGING, PROCEEDINGS, 1998, : 35 - 40
  • [2] Thermal fatigue of solder flip-chip assemblies
    Roesner, B
    Baraton, X
    Guttmann, K
    Samin, C
    48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 872 - 877
  • [3] A procedure for automated shape and life prediction in flip-chip and BGA solder joints
    Subbarayan, G
    JOURNAL OF ELECTRONIC PACKAGING, 1996, 118 (03) : 127 - 133
  • [4] Flip chip reliability modeling based on solder fatigue as applied to flip chip on laminate assemblies
    Popelar, S
    Roesch, M
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 477 - 483
  • [5] FLIP-CHIP BONDING WITH SOLDER DIPPING
    BRADY, MJ
    DAVIDSON, A
    REVIEW OF SCIENTIFIC INSTRUMENTS, 1985, 56 (07): : 1459 - 1460
  • [6] Advanced flip-chip solder bonding
    Humpston, G
    Needham, AP
    NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT, 1997, 395 (03): : 375 - 378
  • [7] Solder Fatigue Modeling of Flip-Chip Bumps in Molded Packages
    Shim, Kar Wei
    Lo, Wai Yew
    IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 109 - 114
  • [8] Thermal fatigue failure analysis of SnPb solder joint in flip-chip assemblies
    Cai, Xia
    Chen, Liu
    Zhang, Qun
    Xu, Bulu
    Huang, Weidong
    Xie, Xiaoming
    Cheng, Zhaonian
    Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors, 2002, 23 (06): : 660 - 667
  • [9] Reliability assessment of flip-chip assemblies with lead-free solder joints
    Schubert, A
    Dudek, R
    Walter, H
    Jung, E
    Gollhardt, A
    Michel, B
    Reichl, H
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 1246 - 1255
  • [10] Quantitative characterization of a flip-chip solder joint
    Patra, S.K.
    Sritharan, S.S.
    Lee, Y.C.
    Journal of Applied Mechanics, Transactions ASME, 1995, 62 (02): : 390 - 397
12345