Quantitative characterization of a flip-chip solder joint

被引：0
|
作者：
Patra, S.K. [1 ]
Sritharan, S.S. [1 ]
Lee, Y.C. [1 ]
机构：
[1] Univ of Colorado, Boulder, United States
来源：
Journal of Applied Mechanics, Transactions ASME | 1995年 / 62卷 / 02期
关键词：
14;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
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页码：390 / 397
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