Process induced residual stresses in isotropically conductive adhesive joints

被引：0
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作者：
Wu, Sean X. [1 ]
Mei, Yuhai [1 ]
Yeh, Chao-pin [1 ]
Wyatt, Karl W. [1 ]
机构：
[1] Motorola, Inc, Schaumburg, United States
来源：
IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing | 1996年 / 19卷 / 04期
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页码：251 / 256
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