Process induced residual stresses in isotropically conductive adhesive joints

被引：0

作者：

Wu, Sean X. ^{[1
]}

Mei, Yuhai ^{[1
]}

Yeh, Chao-pin ^{[1
]}

Wyatt, Karl W. ^{[1
]}

机构：

[1] Motorola, Inc, Schaumburg, United States

来源：

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing | 1996年 / 19卷 / 04期

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摘要：

引用

页码：251 / 256

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