Characterization of silicon isotropic etch by inductively coupled plasma etch in post-CMOS processing

被引：0
|
作者：
Zhu, Xu [1 ]
Greve, David W. [1 ]
Fedder, Gary K. [1 ]
机构：
[1] Carnegie Mellon Univ, Pittsburgh, United States
来源：
Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) | 2000年
关键词：
Inductively coupled plasma (ICP) etching;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：568 / 573
相关论文
共 50 条
  • [31] PLASMA-INDUCED DAMAGE IN A PLANAR INDUCTIVELY-COUPLED ETCH REACTOR
    COTLER, TJ
    FORSTER, J
    BARNES, M
    KOCON, W
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1994, 141 (11) : 3218 - 3221
  • [32] Study on the etch characteristics of BST thin films by using inductively coupled plasma
    Kim, GH
    Kim, KT
    Kim, DP
    Kim, CI
    Park, CS
    Kwon, KH
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2004, 45 : S724 - S727
  • [33] Improved etch characteristics Of SiO2 by the enhanced inductively coupled plasma
    Cho, SB
    Song, HY
    Park, SG
    O, BH
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 2001, 19 (04): : 1308 - 1311
  • [34] Etch induced Damage of HgCdTe Caused by Inductively Coupled Plasma Etching Technique
    Yin, Wenting
    Zhou, Wenhong
    Huang, Jian
    5TH INTERNATIONAL SYMPOSIUM ON ADVANCED OPTICAL MANUFACTURING AND TESTING TECHNOLOGIES: OPTOELECTRONIC MATERIALS AND DEVICES FOR DETECTOR, IMAGER, DISPLAY, AND ENERGY CONVERSION TECHNOLOGY, 2010, 7658
  • [35] Real-time control of ion density and ion energy in chlorine inductively coupled plasma etch processing
    Chang, CH
    Leou, KC
    Lin, C
    Lin, TL
    Tseng, CW
    Tsai, CH
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2003, 21 (04): : 1183 - 1187
  • [36] Microscale pattern etch of 4H–SiC by inductively coupled plasma
    Shiwei Zhuang
    Jiale Tang
    Zhiqiang Gu
    Dongchen Che
    Dongdong Hu
    Lu Chen
    Kaidong Xu
    Journal of Materials Science: Materials in Electronics, 2019, 30 : 18788 - 18793
  • [37] Microscale pattern etch of 4H-SiC by inductively coupled plasma
    Zhuang, Shiwei
    Tang, Jiale
    Gu, Zhiqiang
    Che, Dongchen
    Hu, Dongdong
    Chen, Lu
    Xu, Kaidong
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 30 (20) : 18788 - 18793
  • [38] Silicon etch process options for micro- and nanotechnology using inductively coupled plasmas
    Welch, CC
    Goodyear, AL
    Wahlbrink, T
    Lemme, MC
    Mollenhauer, T
    MICROELECTRONIC ENGINEERING, 2006, 83 (4-9) : 1170 - 1173
  • [39] Recouping etch rates in pulsed inductively coupled plasmas
    Agarwal, Ankur
    Stout, Phillip J.
    Banna, Samer
    Rauf, Shahid
    Collins, Ken
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2011, 29 (01):
  • [40] Characterization of an Etch Profile at a Wafer Edge in Capacitively Coupled Plasma
    Seong, Inho
    Lee, Jinho
    Kim, Sijun
    Lee, Youngseok
    Cho, Chulhee
    Lee, Jangjae
    Jeong, Wonnyoung
    You, Yebin
    You, Shinjae
    NANOMATERIALS, 2022, 12 (22)
12345