Characterization of silicon isotropic etch by inductively coupled plasma etch in post-CMOS processing

被引：0
|
作者：
Zhu, Xu [1 ]
Greve, David W. [1 ]
Fedder, Gary K. [1 ]
机构：
[1] Carnegie Mellon Univ, Pittsburgh, United States
来源：
Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) | 2000年
关键词：
Inductively coupled plasma (ICP) etching;
D O I：
暂无
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学科分类号：
摘要：
引用
收藏
页码：568 / 573
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