Surface characterization of nickel alloy plasma-treated by O2/CF4 mixture

被引:0
|
作者
机构
[1] Chan-Park, Mary B.
[2] Gao, Jianxia
[3] Koo, Arthur H.L.
来源
Chan-Park, M.B. (mbechan@ntu.edu.sg) | 1979年 / VSP BV卷 / 17期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [31] Study on CF4/O2 plasma resistance of O-ring elastomer materials
    Goto, Tetsuya
    Obara, Shogo
    Shimizu, Tomoya
    Inagaki, Tsuyoshi
    Shirai, Yasuyuki
    Sugawa, Shigetoshi
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2020, 38 (01):
  • [32] MASS-SPECTROMETRIC TRANSIENT STUDY OF DC PLASMA-ETCHING OF SI IN CF4 AND CF4/O2 MIXTURES
    BRANDT, WW
    HONDA, T
    JOURNAL OF APPLIED PHYSICS, 1985, 57 (01) : 119 - 122
  • [33] Modifying wetting properties of PI Film: The impact of surface texturing and CF4 and O2 plasma treatment
    Aktas, Cihan
    Bhethanabotla, Venkat
    Ayyala, Ramesh S.
    Sahiner, Nurettin
    APPLIED SURFACE SCIENCE, 2024, 656
  • [34] Modifying wetting properties of PI Film: The impact of surface texturing and CF4 and O2 plasma treatment
    Aktas, Cihan
    Bhethanabotla, Venkat
    Ayyala, Ramesh S.
    Sahiner, Nurettin
    Applied Surface Science, 2024, 656
  • [35] Novel technique to pattern silver using CF4 and CF4/O2 glow discharges
    Nguyen, P
    Zeng, YX
    Alford, TL
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2001, 19 (01): : 158 - 165
  • [36] Surface characteristics of parylene-C films in an inductively coupled O2/CF4 gas plasma
    Ham, Yong-Hyun
    Shutov, Dmitriy Alexandrovich
    Baek, Kyu-Ha
    Do, Lee-Mi
    Kim, Kwangsoo
    Lee, Chi-Woo
    Kwon, Kwang-Ho
    THIN SOLID FILMS, 2010, 518 (22) : 6378 - 6381
  • [37] CF4/O2/He reaction chemistry in an atmospheric pressure plasma jet
    Kim, Y
    Teslow, HL
    Park, J
    Rosocha, LA
    Herrmann, HW
    JOURNAL OF ADVANCED OXIDATION TECHNOLOGIES, 2005, 8 (02) : 182 - 187
  • [38] EPOXY ETCH RATE AND ACTIVATION-ENERGY IN CF4/O2 PLASMA
    LU, NH
    BABU, SV
    REMBETSKI, JF
    NILSEN, C
    WELSH, JA
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1984, 131 (08) : C309 - C309
  • [39] KINETIC ASPECTS OF PLASMA-ETCHING OF POLYIMIDE IN CF4/O2 DISCHARGES
    SCOTT, PM
    BABU, SV
    PARTCH, RE
    MATIENZO, LJ
    POLYMER DEGRADATION AND STABILITY, 1990, 27 (02) : 169 - 181