Using computer models to identify optimal conditions for flip-chip assembly and reliability

被引：6
|
作者：
Bailey, Christopher [1 ]
Lu, Hua [1 ]
Glinski, Greg [1 ]
Wheeler, Daniel [1 ]
Hamilton, Phil [2 ]
Hendriksen, Mike [2 ]
Smith, Brian [2 ]
机构：
[1] Centre for Numerical Modelling and Process Analysis, School of Computing and Mathematical Sciences, University of Greenwich, London, United Kingdom
[2] Celestica Limited, Stoke-on-Trent, United Kingdom
来源：
| 1600年 / Emerald Group Publishing Ltd.卷 / 28期
关键词：
Flip-chip assembly;
D O I：
10.1108/03056120210696658
中图分类号：
学科分类号：
摘要：
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