On the resolving power of thermal viewing devices

被引:0
|
作者
Miroshnikov, M.M.
Kulikoyskaya, N.I.
Chernyaev Yu., S.
机构
来源
| 1975年 / 42卷 / 01期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
Different types of objectives for thermal viewing devices are examined, and their resolution is evaluated, taking into consideration the nature of the point spread energy distribution.
引用
收藏
页码:10 / 12
相关论文
共 50 条
  • [21] A Dynamic Thermal Controller for Power Semiconductor Devices
    Sathik, Mohamed Halick Mohamed
    Prasanth, Sundararajan
    Sasongko, Firman
    Padmanabhan, Sampath Kumar
    Pou, Josep
    Simanjorang, Rejeki
    THIRTY-THIRD ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2018), 2018, : 2792 - 2797
  • [22] A Review of Thermal Interface Materials for Power Devices
    Wang, Jinyu
    Zhang, Yonghai
    Wei, Jinjia
    Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics, 2022, 43 (10): : 2699 - 2710
  • [23] Thermal management of lateral GaN power devices
    Yu, Chenjiang
    Laboure, Eric
    Buttay, Cyril
    2015 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP), 2015, : 40 - 43
  • [24] Thermal Layout Optimization of Power Devices on PCB
    Luo, Dan
    Zhao, Yao
    Wang, Zhiqiang
    Li, Guofeng
    PROCEEDINGS OF 2023 INTERNATIONAL CONFERENCE ON WIRELESS POWER TRANSFER, VOL 3, ICWPT 2023, 2024, 1160 : 181 - 188
  • [25] Joint Power and Thermal Management for Implantable Devices
    Chai, Ruizhi
    Zhang, Ying
    Ghovanloo, Maysam
    2015 IEEE BIOMEDICAL CIRCUITS AND SYSTEMS CONFERENCE (BIOCAS), 2015, : 65 - 68
  • [26] Thermal modeling of semiconductor devices in power modules
    Ammous, Kaicar
    Abid, Slim
    Ammous, Anis
    MICROELECTRONICS INTERNATIONAL, 2007, 24 (03) : 46 - 54
  • [27] Thermal and Power Characterization of Real Computing Devices
    Reda, Sherief
    IEEE JOURNAL ON EMERGING AND SELECTED TOPICS IN CIRCUITS AND SYSTEMS, 2011, 1 (02) : 76 - 87
  • [28] Accuracy of Thermal Analysis for SiC Power Devices
    Race, S.
    Ziemann, T.
    Tiwari, S.
    Kovacevic-Badstuebner, I
    Grossner, U.
    2021 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2021,
  • [29] Thermal management of power surface mount devices
    Hollander, Dave, 1600, (03):
  • [30] Thermal Interaction of Dissipating Devices in Power Applications
    Sluijs, Ferdinand
    2017 23RD INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2017,