共 50 条
- [41] POWER SUPPLY CONSTRUCTION FOR USE ON PRINTED CIRCUIT BOARDS. IBM technical disclosure bulletin, 1983, 26 (04): : 1853 - 1854
- [42] ADDITIVE METHODS FOR PRODUCTION OF PRINTED-CIRCUIT BOARDS. Soviet electrical engineering, 1979, 50 (04): : 72 - 76
- [43] ADVANCES IN ELECTROLYTIC COPPER PLATING OF PRINTED CIRCUIT BOARDS. Electri-onics, 1986, 32 (03): : 29 - 32
- [44] Vapour Phase Soldering on Flexible Printed Circuit Boards 2014 IEEE 20TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME), 2014, : 69 - 74
- [45] AUTOMATIC SOLDERING MACHINE FOR PRINTED CIRCUIT ASSEMBLY BOARDS PROCEEDINGS OF THE INSTITUTE OF RADIO ENGINEERS, 1958, 46 (03): : 628 - 628
- [47] Binary Photosensitizers for Fully Additive Production of Printed Circuit Boards. MO Metalloberflache Beschichten von Metall und Kunststoff, 1986, 40 (02): : 67 - 69
- [48] METHOD FOR STRIPPING/ETCHING OF METALLIZATION ON CIRCUIT BOARDS. IBM technical disclosure bulletin, 1985, 28 (02):
- [50] Investigating Printed Circuit Board Shrinkage During Reflow Soldering PROCEEDINGS OF THE 2014 37TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE) - ADVANCES IN ELECTRONIC SYSTEM INTEGRATION, 2014, : 219 - 224