Reflow Soldering as a Contacting Method for Joining Flat Conductors with Flat Printed Circuit Boards.

被引：0
|
作者：
Richter, Dieter
Rank, Winfried
机构：
来源：
Schweisstechnik (Berlin) | 1973年 / 23卷 / 09期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
1
引用
收藏
页码：403 / 405
相关论文
共 50 条
  • [31] SOLDERING OF SMDS ON PRINTED-CIRCUIT BOARDS
    WINTELER, O
    F&M-FEINWERKTECHNIK & MESSTECHNIK, 1986, 94 (06): : 351 - 355
  • [32] New Fabrication Facilities for Printed-Circuit Boards.
    Augsburg, Gunter
    Hoffman, Manfred
    Wuensche, Hatto
    Siemens-Zeitschrift, 1976, 50 (04): : 222 - 224
  • [33] Soldering Tests with Biodegradable Printed Circuit Boards
    Geczy, A.
    Garami, T.
    Kovacs, B.
    Nagy, D.
    Gal, L.
    Ruszinko, M.
    Hajdu, I.
    2013 IEEE 19TH INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY IN ELECTRONIC PACKAGING (SIITME), 2013, : 39 - 42
  • [34] COMPUTER SYSTEM ACCELERATES DESIGN OF PRINTED CIRCUIT BOARDS.
    Allum, Bob
    Paterson, John
    Shastry, Balakrishna
    1600, (04):
  • [35] REMOVING SOLDER BRIDGES FROM PRINTED CIRCUIT BOARDS.
    Comerford, M.F.
    Insulation, circuits, 1981, 27 (04): : 31 - 34
  • [36] Investigating heat transfer coefficient differences on printed circuit boards during vapour phase reflow soldering
    Geczy, Attila
    INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2017, 109 : 167 - 174
  • [37] Currentless Copper Plating of Multilayer Printed Circuit Boards.
    Beier, Ernst
    Elektronikpraxis, 1980, 15 (12): : 76 - 79
  • [38] HOW TO SELECT A CONFORMAL COATING FOR PRINTED CIRCUIT BOARDS.
    Waryold, John
    Insulation/Circuits, 1974, 20 (07): : 29 - 31
  • [39] Automatic Adjustment Associated with Testing of Printed Circuit Boards.
    Muehlbauer, H.
    Elektronik Produktion & Prueftechnik, 1987, (09): : 23 - 24
  • [40] ELECTROMECHANICAL RELAYS GAINING SPACE ON PRINTED CIRCUIT BOARDS.
    MORRIS, HENRY M.
    1982, V 29 (N 12): : 78 - 79
12345