Adhesion strength of silver thick-film conductors by solder-free test

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Keio Univ, Yokohama, Japan ^{[1
]}

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J Mater Sci | / 18卷 / 4967-4971期

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[31] INTERFACING OF CONDUCTORS WITH THICK-FILM MATERIALS FOR HYBRID MICROELECTRONICS
COUNTS, WE
VITRIOL, WA
AMERICAN CERAMIC SOCIETY BULLETIN, 1974, 53 (08): : 606 - 606
[32] HIGH TENSILE STRENGTH THICK-FILM SILVER-PALLADIUM METALLISATIONS.
Lemon, T.H.
Platinum Metals Review, 1975, 19 (04): : 146 - 153
[33] SILVER MIGRATION AND THE RELIABILITY OF PD-AG CONDUCTORS IN THICK-FILM DIELECTRIC CROSSOVER STRUCTURES
NAGUIB, HM
MACLAURIN, BK
IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1979, 2 (02): : 196 - 207
[34] FRACTURE APPROACH TO THICK-FILM ADHESION MEASUREMENTS
BASCOM, WD
BITNER, JL
JOURNAL OF MATERIALS SCIENCE, 1977, 12 (07) : 1401 - 1410
[35] THICK-FILM PASTE ADHESION AND THERMAL CYCLING
ACTERMAN, JS
OLSEN, CE
YOUNG, WS
AMERICAN CERAMIC SOCIETY BULLETIN, 1979, 58 (03): : 363 - 363
[36] THICK-FILM RESISTORS WITH THIN-FILM CONDUCTORS - COMPATIBILITY STUDY
CURNAN, HJ
BROWN, R
AMERICAN CERAMIC SOCIETY BULLETIN, 1974, 53 (08): : 606 - 606
[37] EFFECTS OF GLASS MODIFIERS ON THE ADHESION STRENGTH OF THICK-FILM CONDUCTOR-ALUMINA SYSTEMS
FU, SL
WU, ET
MACKENZIE, JD
AMERICAN CERAMIC SOCIETY BULLETIN, 1981, 60 (09): : 932 - 932
[38] ADVANCES IN THICK-FILM CONDUCTORS FOR MICROWAVE INTEGRATED-CIRCUITS
JOHNSON, RW
RICH, PW
RICH, DD
WILSON, LK
ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1980, 6 (3-4): : 215 - 218
[39] STRUCTURE AND PROPERTIES OF REACTIVELY BONDED THICK-FILM GOLD CONDUCTORS
COLEMAN, MV
GURNETT, GE
ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1978, 5 (01): : 55 - 59
[40] EFFECT OF PROCESS VARIABLES ON MICROWAVE CONDUCTIVITY OF THICK-FILM CONDUCTORS
CORKHILL, JR
ODONNELL, ER
ELECTRONICS LETTERS, 1972, 8 (20) : 500 - &

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