MODEL FOR WAFER FABRICATION DYNAMICS IN INTEGRATED CIRCUIT MANUFACTURING.

被引:0
|
作者
Dayhoff, Judith E. [1 ]
Atherton, Robert W. [1 ]
机构
[1] Judith Dayhoff & Associates Inc,, Mountain View, CA, USA, Judith Dayhoff & Associates Inc, Mountain View, CA, USA
来源
关键词
MATHEMATICAL MODELS - PROBABILITY - Queueing Theory - PRODUCTION ENGINEERING;
D O I
暂无
中图分类号
学科分类号
摘要
A model is presented of the components and interactions of water movements, processing equipment, and process steps. The model considers multiple process flows, fabrication organization and layout, and equipment properties such as batch size, process time, failure, and repair distributions. The model is implemented as a discrete-event simulation and has been used in a number of case studies concerning realistic factory situations. This stimulation model is general and can be used to study many types of discrete manufacturing.
引用
收藏
页码:91 / 100
相关论文
共 50 条
  • [21] PERKINS AIMS AT FULLY INTEGRATED MANUFACTURING.
    Anon
    Automotive industries, 1984, 164 (01):
  • [22] INTEGRATED DATA BASE FOR COMPUTER-INTEGRATED MANUFACTURING.
    Sepehri, Mehran
    IEEE Circuits and Devices Magazine, 1987, 3 (02): : 48 - 54
  • [23] An investigation of wafer-to-wafer alignment tolerances for three-dimensional integrated circuit fabrication
    Warner, K
    Chen, C
    D'Onofrio, R
    Keast, C
    Poesse, S
    2004 IEEE INTERNATIONAL SOI CONFERENCE, PROCEEDINGS, 2004, : 71 - 72
  • [24] MATERIAL HANDLING: THE SMART LINK TO INTEGRATED MANUFACTURING.
    Hemond, Robert F.
    Production engineering, 1986, 33 (04): : 40 - 42
  • [25] IMPLICATIONS OF DISTRIBUTED PROCESSING IN COMPUTER INTEGRATED MANUFACTURING.
    Winfrey, Richard C.
    Technical Paper - Society of Manufacturing Engineers. MS, 1982,
  • [26] Wafer-Scale Characterization of a Superconductor Integrated Circuit Fabrication Process, Using a Cryogenic Wafer Prober
    West, Joshua T.
    Kurlej, Arthur
    Wynn, Alex
    Rogers, Chad
    Gouker, Mark A.
    Tolpygo, Sergey K.
    IEEE TRANSACTIONS ON APPLIED SUPERCONDUCTIVITY, 2022, 32 (05)
  • [27] COMBINING ADDITIVE AND SUBTRACTIVE PROCESSES IN CIRCUIT BOARD MANUFACTURING.
    Eckhardt, John
    Insulation/Circuits, 1975, 21 (03): : 37 - 40
  • [28] Predicting integrated circuit reliability from wafer fabrication technology reliability data
    Tan, Cher Ming
    He, FeiFei
    2007 INTERNATIONAL SYMPOSIUM ON INTEGRATED CIRCUITS, VOLS 1 AND 2, 2007, : 267 - 270
  • [29] COMPUTER-AIDED DESIGN FOR PRINTED CIRCUIT BOARD AND HYBRID CIRCUIT MANUFACTURING.
    Hewlett, Ray
    Robotics Amsterdam, 1985, 1 (03):
  • [30] Inspection of integrated circuit databases through reticle and wafer simulation: An integrated approach to design for manufacturing (DFM)
    Howard, W
    Azpiroz, JT
    Xiong, YL
    Mack, C
    Verma, G
    Volk, W
    Lehon, H
    Deng, YF
    Shi, RF
    Culp, J
    Mansfield, S
    DESIGN AND PROCESS INTEGRATION FOR MICROELECTRONIC MANUFACTURING III, 2005, 5756 : 61 - 72