Stress development in low dielectric constant silica films during drying and heating process

被引：0
|
作者：
Lu, Mengcheng [1 ]
Brinker, C. Jeffrey [2 ]
机构：
[1] Advanced Materials Laboratory, University of New Mexico, NSF Center for Micro-Engineering Materials, 1001 University Blvd. SE, Albuquerque, NM 87106, United States
[2] Sandia National Lab., Albuquerque, NM 87185, United States
来源：
Materials Research Society Symposium - Proceedings | 2000年 / 594卷
关键词：
Cantilever beam technique - Laser deflection method - Pressure aerogel processes;
D O I：
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中图分类号：
学科分类号：
摘要：
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页码：463 / 468
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