Classifying defects for copper CMP process modules

被引：0
|
作者：
Steckenrider, J. Scott
Guha, Sumit
Sethuraman, Anantha
Ra, Younsoo
Kim, Hawk
机构：
[1] Cabot Microelectronics, Aurora, IL, United States
[2] Intel, Santa Clara, CA, United States
[3] Wafer Inspection Division, KLA-Tencor, San Jose, CA, United States
[4] EEP Group, KLA-Tencor, San Jose, CA, United States
来源：
MICRO | 2001年 / 19卷 / 08期
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页码：33 / 45
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