THERMAL CONDUCTIVITY OF WHEAT, CORN, AND GRAIN SORGHUM AS AFFECTED BY BULK DENSITY AND MOISTURE CONTENT.

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作者：
Chang, C.S. [1 ]
机构：
[1] USDA, Manhattan, KS, USA, USDA, Manhattan, KS, USA
来源：
Transactions of the American Society of Agricultural Engineers | 1986年 / 29卷 / 05期
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摘要：
14
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页码：1447 / 1450
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