THERMAL CONDUCTIVITY OF WHEAT, CORN, AND GRAIN SORGHUM AS AFFECTED BY BULK DENSITY AND MOISTURE CONTENT.

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Chang, C.S. ^{[1
]}

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[1] USDA, Manhattan, KS, USA, USDA, Manhattan, KS, USA

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Transactions of the American Society of Agricultural Engineers | 1986年 / 29卷 / 05期

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页码：1447 / 1450

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