Investigation of strained Si/SiGe-OI heterostructure with high resolution electron microscope

被引:0
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作者
Ma, Tongda [1 ]
Tu, Hailing [1 ]
Shao, Beiling [1 ]
Chen, Changchun [2 ]
Huang, Wentao [2 ]
机构
[1] Gen. Res. Inst. of Nonferrous Metals, Beijing 100088, China
[2] Inst. of Microelectronics, Tsinghua Univ., Beijing 100084, China
关键词
Chemical vapor deposition - Dislocations (crystals) - Heterojunction bipolar transistors - High resolution electron microscopy - Relaxation processes - Semiconducting germanium - Semiconducting silicon - Silicon on insulator technology;
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摘要
Observations on cross-sectional microstructure of Si/SiGe-OI grown by ultra-high vacuum chemical vapor deposition are done with an electron microscope with high resolution for investigating relaxation mechanism of strain induced by misfit. The cross-sectional image of Si/SiGe-OI multi-layer structure,the lattice image of every epitaxial layer, and the interfaces of adjoining epitaxial layers are shown respectively. 60° dislocations and stacking faults distributed in the multi-layer structure are found. Some related theories are applied to explain the configuration of the defects. The reasons are discussed about formation and existing of 60° misfit dislocations using critical thickness model developed by Matthews and Blakeslee and other related investigations. The theoretical conclusion predicted by Gosling and his co-workers is proved reliable that single misfit dislocations generally lie in the interface between strained Si1-xGex layer and Si substrate for a heterostructure with a capping layer thinner than its critical thickness.
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页码:1123 / 1127
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