Investigation of strained Si/SiGe-OI heterostructure with high resolution electron microscope

被引:0
|
作者
Ma, Tongda [1 ]
Tu, Hailing [1 ]
Shao, Beiling [1 ]
Chen, Changchun [2 ]
Huang, Wentao [2 ]
机构
[1] Gen. Res. Inst. of Nonferrous Metals, Beijing 100088, China
[2] Inst. of Microelectronics, Tsinghua Univ., Beijing 100084, China
关键词
Chemical vapor deposition - Dislocations (crystals) - Heterojunction bipolar transistors - High resolution electron microscopy - Relaxation processes - Semiconducting germanium - Semiconducting silicon - Silicon on insulator technology;
D O I
暂无
中图分类号
学科分类号
摘要
Observations on cross-sectional microstructure of Si/SiGe-OI grown by ultra-high vacuum chemical vapor deposition are done with an electron microscope with high resolution for investigating relaxation mechanism of strain induced by misfit. The cross-sectional image of Si/SiGe-OI multi-layer structure,the lattice image of every epitaxial layer, and the interfaces of adjoining epitaxial layers are shown respectively. 60° dislocations and stacking faults distributed in the multi-layer structure are found. Some related theories are applied to explain the configuration of the defects. The reasons are discussed about formation and existing of 60° misfit dislocations using critical thickness model developed by Matthews and Blakeslee and other related investigations. The theoretical conclusion predicted by Gosling and his co-workers is proved reliable that single misfit dislocations generally lie in the interface between strained Si1-xGex layer and Si substrate for a heterostructure with a capping layer thinner than its critical thickness.
引用
收藏
页码:1123 / 1127
相关论文
共 50 条
  • [1] Monte Carlo simulations of strained Si/SiGe-OI nMOSFETs
    Yangthaisong, A.
    Osotchan, T.
    2006 IEEE CONFERENCE ON EMERGING TECHNOLOGIES - NANOELECTRONICS, 2006, : 438 - +
  • [2] Conduction band discontinuity and electron mobility in a strained Si/SiGe heterostructure
    Garchery, L
    Sagnes, I
    Badoz, PA
    APPLIED SURFACE SCIENCE, 1996, 102 : 202 - 207
  • [3] THERMAL RELAXATION OF STRAINED SIGE/SI HETEROSTRUCTURE
    SHIGEKAWA, H
    KANAYA, H
    CHO, Y
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1990, 29 (05): : L736 - L738
  • [4] Thermal relaxation of strained SiGe/Si heterostructure
    Shigekawa, Hidemi, 1600, (29):
  • [5] High field transport of hot electrons in strained Si/SiGe heterostructure
    Miyatsuji, Kazuo
    Ueda, Daisuke
    Masaki, Kazuo
    Yamakawa, Shinya
    Hamaguchi, Chihiro
    Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes & Review Papers, 1994, 33 (4B): : 2378 - 2380
  • [6] High field transport of hot electrons in strained Si/SiGe heterostructure
    Miyatsuji, Kazuo
    Ueda, Daisuke
    Masaki, Kazuo
    Yamakawa, Shinya
    Hamaguchi, Chihiro
    Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1994, 33 (4 B): : 2378 - 2380
  • [7] Plasma etching induced damage to strained Si/SiGe/Si heterostructure
    Swain, PK
    Misra, D
    Cole, M
    1996 1ST INTERNATIONAL SYMPOSIUM ON PLASMA PROCESS-INDUCED DAMAGE, 1996, : 133 - 136
  • [8] HIGH-FIELD TRANSPORT OF HOT-ELECTRONS IN STRAINED SI/SIGE HETEROSTRUCTURE
    MIYATSUJI, K
    UEDA, D
    MASAKI, K
    YAMAKAWA, S
    HAMAGUCHI, C
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1994, 33 (4B): : 2378 - 2380
  • [9] Sub-micron strained Si:SiGe heterostructure MOSFETs
    Clifton, PA
    Lavelle, SJ
    ONeill, AG
    MICROELECTRONICS JOURNAL, 1997, 28 (6-7) : 691 - 701
  • [10] High electron and hole mobility enhancements in thin-body strained Si/Strained SiGe/strained Si heterostructures on insulator
    Åberg, I
    Chléirigh, CN
    Olubuyide, OO
    Duan, X
    Hoyt, JL
    IEEE INTERNATIONAL ELECTRON DEVICES MEETING 2004, TECHNICAL DIGEST, 2004, : 173 - 176