3-D SYSTEM FOR INTERCONNECTION MEETS THE CHALLENGE OF HIGH DENSITY PACKAGING.

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作者：
Anstey, Mike [1 ]
机构：
[1] ICDC Ltd, Wokingham, Engl, ICDC Ltd, Wokingham, Engl
来源：
| 1600年 / 25期
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摘要：
ELECTRONICS PACKAGING
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