Plasma treatment and dry etch characteristics of organic low-k dielectrics

被引:0
|
作者
Wei, Ta-Chin [1 ]
Liu, Chi-Hung [1 ]
Shieh, Jia-Ming [1 ]
Suen, Shich-Chang [1 ]
Dai, Bau-Tong [1 ]
机构
[1] Chung Yuan Univ, Chung Li, Taiwan
来源
| 2000年 / 39期
关键词
Helicon-wave high-density oxygen plasmas;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [41] Rapid Recovery Process of Plasma Damaged Porous Low-K Dielectrics by Wet Surface Modifying Treatment
    Iwasaki, Akihisa
    Higuchi, Ayumi
    Komori, Kana
    Sato, Masanobu
    Kesters, Els
    Quoc Toan Le
    Holsteyns, Frank
    ULTRA CLEAN PROCESSING OF SEMICONDUCTOR SURFACES XIII, 2016, 255 : 223 - 226
  • [42] Significance of plasma-surface interactions in the etch behavior of low-k materials
    Pranda, Adam
    Grzeskowiak, Steven
    Tsai, Yu- Hao
    Yoshida, Yusuke
    Liu, Eric
    Han, Yun
    Biolsi, Peter
    Kobayashi, Ken
    Ikezawa, Nobuyuki
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2023, 41 (06):
  • [43] Fundamental properties of organic low-k dielectrics usable in the Cu damascene process
    Nomura, Y
    Ota, F
    Kurino, H
    Koyanagi, M
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2005, 44 (11): : 7876 - 7882
  • [44] Cu/Low-k TDDB degradation using ultra low-k (ULK) dielectrics
    Miura, Noriko
    Goto, Kinya
    Hashii, Shinobu
    Suzumura, Naohito
    Miyazaki, Hiroshi
    Matsumoto, Masahiro
    Matsuura, Masazumi
    Asai, Koyu
    ADVANCED METALLIZATION CONFERENCE 2006 (AMC 2006), 2007, : 481 - 487
  • [45] Novel Dielectric Etch Chemistry for the next generation of Circuit Edit: Delicate to Low-k Dielectrics and Silicon
    Makarov, Vladimir V.
    Krasnobayev, Leo
    Misquitta, Sabina F.
    ISTFA 2009, 2009, : 106 - +
  • [46] Low-k insulators as the choice of dielectrics in organic field-effect transistors
    Veres, J
    Ogier, SD
    Leeming, SW
    Cupertino, DC
    Khaffaf, SM
    ADVANCED FUNCTIONAL MATERIALS, 2003, 13 (03) : 199 - 204
  • [47] Effect of CH4 plasma treatment on O2 plasma ashed organosilicate low-k dielectrics
    Shi, Hualiang
    Bao, Junjing
    Liu, Junjun
    Huang, Huai
    Smith, Ryan Scott
    Goodner, Michael D.
    Moinpour, Mansour
    Kloster, Grant M.
    Zhao, Qiu
    Ho, Paul S.
    MATERIALS, PROCESSES, INTEGRATION AND RELIABILITY IN ADVANCED INTERCONNECTS FOR MICRO- AND NANOELECTRONICS, 2007, 990 : 51 - 56
  • [48] Selection of ESH solvents for the wet removal of post-etch photoresists in low-k dielectrics integration
    Kesters, E.
    Claes, M.
    Le, Q. T.
    Barthomeuf, K.
    Lux, M.
    Vereecke, G.
    Durkee, J. B.
    MICROELECTRONIC ENGINEERING, 2009, 86 (02) : 160 - 164
  • [49] Diffusion barriers for fluorinated low-k dielectrics
    DelaRosa, M
    Kumar, A
    Bakhru, H
    Lu, TM
    ADVANCED INTERCONNECTS AND CONTACTS, 1999, 564 : 559 - 564
  • [50] Improved Plasma Resistance for Porous Low-k Dielectrics by Pore Stuffing Approach
    Zhang, Liping
    de Marneffe, Jean-Francois
    Heyne, Markus H.
    Naumov, Sergej
    Sun, Yiting
    Zotovich, Alexey
    el Otell, Ziad
    Vajda, Felim
    De Gendt, Stefan
    Baklanov, Mikhail R.
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2015, 4 (01) : N3098 - N3107