Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 1 - Without Underfill

被引：0
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作者：
Darbha, K. [1 ]
Okura, J.H. [1 ]
Dasgupta, A. [1 ]
机构：
[1] CALCE Electron. Prod. Syst. C., University of Maryland, College Park, MD 20742, United States
来源：
Journal of Electronic Packaging, Transactions of the ASME | 1999年 / 121卷 / 04期
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页码：231 / 236
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