Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

被引：0
|
作者：
Lau, John H. [1 ]
Lee, S.-W.Ricky [1 ]
Chang, Chris [1 ]
Ouyang, Chien [1 ]
机构：
[1] Express Packaging Systems, Inc, Palo Alto, CA, United States
来源：
Proceedings - Electronic Components and Technology Conference | 1999年
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页码：571 / 582
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