Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

被引：0
|
作者：
Lau, John H. [1 ]
Lee, S.-W.Ricky [1 ]
Chang, Chris [1 ]
Ouyang, Chien [1 ]
机构：
[1] Express Packaging Systems, Inc, Palo Alto, CA, United States
来源：
Proceedings - Electronic Components and Technology Conference | 1999年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：571 / 582
相关论文
共 50 条
  • [21] Development of no-flow underfill materials for lead-free solder bumped flip-chip applications
    Zhang, ZQ
    Shi, SH
    Wong, CP
    [J]. INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2000, : 278 - 284
  • [22] Influence of different modeling approaches for solder and underfill on the reliability assessment of flip chip assemblies
    Feustel, F
    Wiese, S
    Meusel, E
    [J]. MICRO MATERIALS, PROCEEDINGS, 2000, : 1158 - 1160
  • [23] Study on underfill/solder adhesion in flip-chip encapsulation
    Fan, LH
    Tison, CK
    Wong, CP
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (04): : 473 - 480
  • [24] How to select underfill materials for solder bumped flip chips on low cost substrates?
    Lau, JH
    Chang, C
    [J]. 1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1998, 3582 : 693 - 700
  • [25] Compression flow modeling of underfill encapsulants for low cost flip chip assembly
    Pascarella, NW
    Baldwin, DF
    [J]. 48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 463 - 470
  • [26] Analysis of underfill encapsulation curing deformations on Flip Chip On Board (FCOB) package reliability
    Sch. of Mech. and Prod. Engineering, Nanyang Technological University, Singapore 639798, Singapore
    不详
    [J]. J Electron Manuf, 3 (181-191):
  • [27] Yield and Reliability in Flip Chip Underfill for Optical Modules
    Benjamin, S.
    Maman, A.
    Decker, U.
    Pleyer, W.
    Luesebrink, H.
    [J]. 2014 9TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2014, : 73 - 76
  • [28] Reliability studies of flip chip package with reflowable underfill
    Wang, T
    Chew, TH
    Chew, YX
    Foo, L
    [J]. PAN PACIFIC MICROELECTRONICS SYMPOSIUM, 2001, PROCEEDINGS, 2001, : 65 - 70
  • [29] Variable, frequency microwave processing of underfill encapsulants for flip-chip applications
    Mead, PF
    Ramamoorthy, A
    Pal, S
    Fathi, Z
    [J]. JOURNAL OF ELECTRONIC PACKAGING, 2003, 125 (02) : 302 - 307
  • [30] Reliability analysis of flip chip on board assemblies using no-flow underfill materials
    Thorpe, R
    Baldwin, DF
    [J]. SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM, 1999, : 153 - 158
12345