Die attach for fine pitch wire bond application

被引：0
|
作者：
Giguere, Eric [1 ]
Gauvin, Marco [1 ]
机构：
[1] IBM Canada Ltee, Bromont, Canada
来源：
National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East) | 1999年 / 3卷
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页码：1229 / 1241
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