Die attach for fine pitch wire bond application

被引：0
|
作者：
Giguere, Eric [1 ]
Gauvin, Marco [1 ]
机构：
[1] IBM Canada Ltee, Bromont, Canada
来源：
National Electronic Packaging and Production Conference-Proceedings of the Technical Program (West and East) | 1999年 / 3卷
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1229 / 1241
相关论文
共 50 条
  • [1] Predicting and Avoiding Die Attach, Wire Bond, and Solder Joint Failures
    Hillman, Craig
    2016 INTERNATIONAL SYMPOSIUM ON 3D POWER ELECTRONICS INTEGRATION AND MANUFACTURING (3D-PEIM), 2016,
  • [2] FINE PITCH WIRE BONDING DEVELOPMENT USING A NEW MULTIPURPOSE, MULTIPAD PITCH TEST DIE
    SHU, B
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1991, 14 (04): : 680 - 690
  • [3] WIRE BOND LOOP PROFILE DEVELOPMENT FOR FINE-PITCH LONG-WIRE ASSEMBLY
    GROOVER, R
    SHU, WK
    LEE, SS
    IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1994, 7 (03) : 393 - 399
  • [4] The Solutions of Resistive Ball Bond Failure in Ultra Fine Pitch Wire Bonding
    Ibrahim, Mohd Rusli
    Teck, Siong Chin
    Choi, Yong Cheng
    IEMT 2006: 31ST INTERNATIONAL CONFERENCE ON ELECTRONICS MANUFACTURING AND TECHNOLOGY, 2006, : 365 - 369
  • [5] Wire pull on fine pitch pads: An obsolete test for first bond integrity?
    Sundararaman, V
    Edwards, DR
    Subido, WE
    Test, HR
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 416 - 420
  • [6] Development of a fine pitch copper wire bond process for integrated circuit devices
    Schindler, Sebastian
    Wohnig, Markus
    Wolter, Klaus-Juergen
    2008 31ST INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY: RELIABILITY AND LIFE-TIME PREDICTION, 2008, : 385 - +
  • [7] Fine pitch copper wire bonding on copper bond pad process optimization
    Lam, KW
    Ho, HM
    Stoukatch, S
    Van De Peer, M
    Ratchev, P
    Vath, CJ
    Schervan, A
    Beyne, E
    PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, : 63 - 68
  • [8] Third generation routing for fine-pitch attach technology
    Winning, A
    ELECTRONIC ENGINEERING, 2001, 73 (892): : 65 - 65
  • [9] Comparison between Die Attach Film (DAF) and Film over Wire (FOW) on Stack-die CSP Application
    Chung, C. L.
    Ku, C. W.
    Hsu, H. C.
    Fu, S. L.
    2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, : 703 - 705
  • [10] Fine pitch Cu wire bond process for integrated circuit devices for high volume production
    Schindler, Sebastian
    Wohnig, Markus
    Wolter, Klaus-Juergen
    ESTC 2008: 2ND ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2008, : 767 - +
12345