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- [41] An evaluation of thermal enhancements to flip-chip-plastic ball grid array (FC-PBGA) packages ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003, 2003, : 709 - 719
- [43] Popcorn cracking in a plastic ball grid array package 2ND 1998 IEMT/IMC SYMPOSIUM, 1998, : 200 - 204
- [45] Irregular Bumps Design Planning for Modern Ball Grid Array Packages 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 1838 - 1843
- [46] Enhancing solder joint fatigue life for ball grid array packages PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 701 - 706
- [47] Ball Grid Array (BGA) packages with the copper core solder balls 48TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1998 PROCEEDINGS, 1998, : 692 - 701
- [48] Development of effective compact models for depopulated ball grid array packages PROCEEDINGS OF 3RD ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2000, : 131 - 137
- [49] Finite element analysis of sequential processes for ball grid array packages PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 809 - 814
- [50] Effect of PCB finish on the reliability and wettability of ball grid array packages IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1996, 19 (02): : 320 - 330