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- [22] Nonlinear analysis of full-matrix and perimeter plastic ball grid array solder joints Journal of Electronic Packaging, Transactions of the ASME, 1997, 119 (03): : 163 - 170
- [23] Custom Plastic Ball Grid Array Packages for Microwave Space Applications up to 30 GHz 2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC), 2013,
- [24] APPLICATION OF THE TAGUCHI METHOD ON THE ROBUST DESIGN OF MOLDED 225 PLASTIC BALL GRID ARRAY PACKAGES IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (04): : 734 - 743
- [25] Compact conduction model of ball grid array packages IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2003, 26 (03): : 610 - 615
- [26] Thermal and thermomechanical modelling of ball grid array packages THERMAL MANAGEMENT OF ELECTRONIC SYSTEMS II, 1997, : 329 - 338
- [28] Real-time popcorn analysis of plastic ball grid array packages during solder reflow TWENTY THIRD IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, 1998, : 455 - 463
- [29] Effect of chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array packages Circuit World, 1 (16-19):