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- [2] Qualification of plastic ball grid array packages for space applications 2002 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 2002, 4931 : 123 - 128
- [4] Solder joint reliability of plastic ball grid array packages Soldering and Surface Mount Technology, 1999, 11 (01): : 44 - 48
- [5] Missing solder ball failure mechanisms in plastic ball grid array packages 50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 151 - 159
- [6] Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2009, 32 (04): : 901 - 908
- [7] Moisture absorption and desorption predictions for plastic ball grid array packages IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1997, 20 (03): : 274 - 279
- [8] Moisture absorption and desorption predictions for plastic ball grid array packages INTERSOCIETY CONFERENCE ON THERMAL PHENOMENA IN ELECTRONIC SYSTEMS - I-THERM V, 1996, : 180 - 186
- [9] The effect of ball pad metallurgy and ball composition on solder ball integrity of plastic ball grid array packages ISTFA '98: PROCEEDINGS OF THE 24TH INTERNATIONAL SYMPOSIUM FOR TESTING AND FAILURE ANALYSIS, 1998, : 405 - 411
- [10] Flow modeling and visualization of the transfer molding of plastic ball grid array packages 49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 177 - 184