共 50 条
- [1] Magnetooptic waveguide with SiO2 cladding layer integrated on InP substrate by wafer direct bonding JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1997, 36 (12A): : 7230 - 7232
- [3] Study on the interfacial SiO2 layer of silicon wafer direct bonding 1998 5TH INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY PROCEEDINGS, 1998, : 765 - 767
- [5] Direct bonding between InP substrate and magnetooptic waveguides Jpn J Appl Phys Part 1 Regul Pap Short Note Rev Pap, 7 (4138-4140):
- [6] Direct bonding between InP substrate and magnetooptic waveguides JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1996, 35 (07): : 4138 - 4140
- [7] Room Temperature SiO2 wafer bonding by adhesion layer method 2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 2165 - 2170
- [8] InGaAsP/InP buried heterostruture on SiO2/Si substrate using epitaxial growth after direct bonding of thin active layer 26TH INTERNATIONAL CONFERENCE ON INDIUM PHOSPHIDE AND RELATED MATERIALS (IPRM), 2014,
- [9] Results on Aligned SiO2/SiO2 Direct Wafer-to-Wafer Low Temperature Bonding for 3D Integration 2009 IEEE INTERNATIONAL SOI CONFERENCE, 2009, : 101 - +