Redundancy circuit for a sub-nanosecond, megabit ECL-CMOS SRAM

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作者
Hitachi Device Engineering Co, Ltd, Mobara-shi, Japan [1 ]
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来源
IEICE Trans Electron | / 3卷 / 415-422期
关键词
Bonding - Cellular arrays - CMOS integrated circuits - Degradation - Electric inverters - Emitter coupled logic circuits - Flip flop circuits - Integrated circuit manufacture - Logic gates - Macros - Response time (computer systems);
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摘要
A novel redundancy method suitable for an ultra-high-speed SRAM with logic gates is proposed. Fuse decoders are used to reduce the number of fuses, thus suppressing the access time degradation. This makes it possible to flip chip bond an SRAM with logic gates, which has a high pin count and operates at a very high frequency. To combine the new redundancy method and an ECL decoder circuit with a BiCMOS inverter, several schemes for disabling a defective cell and enabling a spare one are discussed. A 1-Mb ECL-CMOS SRAM with 120-k logic gates was fabricated using 0.3-μm BiCMOS technology. This SRAM consists of 16 RAM macros, and the RAM macro had an access time of only 0.65 ns. The access time degradation after repair was less than 50 ps.
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