THICK FILM ADVANCES SIMPLIFY COMPLEX HYBRID MODULE DESIGN.

被引：0
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作者：
Kirby, Peter
机构：
来源：
Electronic Engineering (London) | 1976年 / 48卷 / 577期
关键词：
INTEGRATED CIRCUITS; HYBRID; -; Manufacture;
D O I：
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学科分类号：
摘要：
The superficial similarity between today's thick film hybrid circuits and some of the early circuits produced about fifteen years ago is claimed to be misleading, because significant progress has been made in every aspect of the subject. It is shown how these improvements can be brought together to produce a new range of advanced hybrid modules which cannot be realized by any other available technique.
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页码：35 / 38
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