HYBRID THICK-FILM CIRCUITS - THEIR DESIGN, APPLICATION AND MANUFACTURE

被引：0

作者：

BROOKE, G ^{[1
]}

BALDWIN, WEB ^{[1
]}

机构：

[1] EMI ELECTR LTD,HAYES,MIDDLESEX,ENGLAND

来源：

WIRELESS WORLD | 1973年 / 79卷 / 1449期

关键词：

D O I：

暂无

中图分类号：

TN [电子技术、通信技术];

学科分类号：

0809 ;

摘要：

引用

页码：121 / 125

页数：5

共 50 条

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VOGEL, P
[J]. HASLER REVIEW, 1980, 13 (3-4): : 38 - 47
[2] THICK-FILM HYBRID CIRCUITS CHARACTERISTICS, MANUFACTURE AND APPLICATION.
Vogel, P.
[J]. Hasler review, 1980, 13 (3-4): : 38 - 47
[3] PLANNING FOR MANUFACTURE OF THICK-FILM HYBRID CIRCUITS IN INDIA
JAIN, AK
[J]. ELECTRONICS INFORMATION & PLANNING, 1978, 5 (06): : 428 - 449
[4] DESIGN AND APPLICATION OF THICK-FILM CIRCUITS
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RUSSELL, RF
[J]. ELECTRICAL COMMUNICATION, 1974, 49 (01): : 51 - 59
[5] HYBRID THICK - FILM CIRCUITS. THEIR DESIGN, APPLICATION AND MANUFACTURE.
Brooke, G.
Baldwin, W.E.B.
[J]. Wireless World, 1973, 79 (1449): : 121 - 125
[6] DESIGN GUIDELINES FOR THICK-FILM HYBRID CIRCUITS.
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[J]. Electronic Packaging and Production, 1979, 19 (07): : 140 - 145
[7] CONTROL FACTORS IN MANUFACTURE OF THICK-FILM CIRCUITS
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[J]. MICROELECTRONICS RELIABILITY, 1968, 7 (02) : 121 - &
[8] The application of finite-element analysis in the design of thick-film hybrid circuits
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[J]. INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS, 2002, 32 (01): : 14 - 21
[9] Thick-film Hybrid Circuits.
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[J]. 1600, (51):
[10] TOOLSET TARGETS THICK-FILM HYBRID CIRCUITS
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[J]. COMPUTER DESIGN, 1989, 28 (19): : 98 - 98