The application of finite-element analysis in the design of thick-film hybrid circuits

In this paper, practical examples of the application of finite-element analysis (FEA) in the design of hybrid thick-film circuits are presented. The electro-thermal behaviour of the circuits was modelled. Simulations were used to predict the resistance and steady-state temperature distribution of differently shaped thick-film resistive elements. A simulation-based analysis of resistor geometry and its position enabled the designer to optimise the circuit layout. In another example, FEA provided a means for visualising the transient-temperature field distribution in a hybrid thick-film circuit. Simulations were used to determine the optimum resistor dimensions and position. The presented examples show how simulations at an early stage of the design phase, or later in the redesign phase, can help to find the required solutions.