Microwave model of anisotropic conductive adhesive flip-chip interconnections for high frequency applications

被引：0
|
作者：
Yim, Myung-Jin [1 ]
Ryu, Woonghwan [1 ]
Jeon, Young-Doo [1 ]
Lee, Junho [1 ]
Kim, Joungho [1 ]
Paik, Kyung-Wook [1 ]
机构：
[1] KAIST, Taejon, Korea, Republic of
来源：
Proceedings - Electronic Components and Technology Conference | 1999年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：488 / 492
相关论文
共 50 条
  • [31] New adhesives for high density flip-chip interconnections
    Wojciechowski, D
    Vanfleteren, J
    Reese, E
    Hagedorn, HW
    1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1998, 3582 : 224 - 229
  • [32] Flip chip interconnection with anisotropic conductive adhesives for RF and high-frequency applications
    Yim, MJ
    Jeong, IH
    Choi, HK
    Hwang, JS
    Ahn, JY
    Kwon, W
    Paik, KW
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2005, 28 (04): : 789 - 796
  • [33] Microwave preheating of anisotropic conductive adhesive films for high-speed flip chip on flex bonding
    Islam, RA
    Chan, YC
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (01) : 123 - 131
  • [34] Study on the Inter Interfacial Residual Stress of Flip-Chip Joints Based on Anisotropic Conductive Adhesive
    Wu, Guanghua
    Jiang, Meixian
    IEEE ACCESS, 2019, 7 : 171923 - 171933
  • [35] Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications
    Chan, YC
    Hung, KC
    Tang, CW
    Wu, CML
    4TH INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING - PROCEEDINGS, 2000, : 141 - 146
  • [36] Flip chip interconnect using anisotropic conductive adhesive
    School of Applied Science, Materials Engineering, Nanyang Technological University, Singapore 639798, Singapore
    不详
    J Mater Process Technol, (484-490):
  • [37] Flip chip interconnect using anisotropic conductive adhesive
    Sarkar, G
    Mridha, S
    Chong, TT
    Tuck, WY
    Kwan, SC
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 1999, 90 : 484 - 490
  • [38] Thermal characterisation of electrically conductive adhesive flip-chip joints
    Sihlbom, A
    Liu, J
    2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, : 251 - 257
  • [39] Variable, frequency microwave processing of underfill encapsulants for flip-chip applications
    Mead, PF
    Ramamoorthy, A
    Pal, S
    Fathi, Z
    JOURNAL OF ELECTRONIC PACKAGING, 2003, 125 (02) : 302 - 307
  • [40] Conductive adhesive flip-chip bonding for bumped and unbumped die
    Connell, G
    Zenner, RLD
    Gerber, JA
    47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 274 - 278
12345