Degradation mechanisms of anisotropic conductive adhesive joints for flip chip on flex applications

被引：28
|
作者：
Chan, YC [1 ]
Hung, KC [1 ]
Tang, CW [1 ]
Wu, CML [1 ]
机构：
[1] City Univ Hong Kong, Dept Elect Engn, Hong Kong, Hong Kong, Peoples R China
来源：
4TH INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING - PROCEEDINGS | 2000年
关键词：
D O I：
10.1109/ADHES.2000.860588
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Flip chip on flex (FCOF) using anisotropic conductive film (ACF) has been demonstrated. Two types of conductive particle in ACF are used in this paper to investigate the effect of pinholes of the the electroless nickel bumps on electrical connection of ACF joints of FCOF samples. The conduction mechanisms of both types of ACF joint due to the effect of pinholes have been discussed. After high temperature and high humidity storage, Ni filled and Au/Ni coated polymer filled ACF joints using non-aged or aged bump chips show slightly and dramatic increases in connection resistance respectively. Detail degradation mechanisms for these ACF joints have been proposed.
引用
收藏
页码：141 / 146
页数：6
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