Verification of flip-chip assembly on FR4 boards

被引：0
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作者：
Beelen-Hendrikx, Caroline [1 ]
Verguld, Martin [1 ]
机构：
[1] Philips Cent for Manufacturing, Technology, Eindhoven, Netherlands
来源：
Soldering and Surface Mount Technology | 1998年 / 30期
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页码：23 / 28
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