MULTILAYER INTERCONNECTIONS USING POLYIMIDE DIELECTRICS AND ALUMINUM CONDUCTORS.

被引：0

作者：

Tsunetsugu, Hideki ^{[1
]}

Takagi, Akihiro ^{[1
]}

Moriya, Kunio ^{[1
]}

机构：

[1] NTT, Musashino Electrical, Communication Lab, Musashino, Jpn, NTT, Musashino Electrical Communication Lab, Musashino, Jpn

来源：

| 1600年 / 08期

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摘要：

引用

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J. Link
Microsystem Technologies, 1999, 5 : 166 - 168
[8] Multilayer polyimide film substrates for interconnections in microsystems
Fach, A
Athanassov, Y
Brunner, U
Hablützel, D
Ketterer, B
Link, J
MICROSYSTEM TECHNOLOGIES, 1999, 5 (04) : 166 - 168
[9] Multilayer polyimide film substrates for interconnections in microsystems
Fach, A.
Athanassov, Y.
Brunner, U.
Hablutzel, D.
Ketterer, B.
Link, J.
Microsystem Technologies, 5 (04): : 166 - 168
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