Voiding in BGAs

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Indium Corp of America, Utica, United States ^{[1
]}

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Soldering Surf Mount Technol | / 21卷 / 44-48期

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[1] Designing with BGAs
Pulliam, Wayne
Printed Circuit Design, 2002, 19 (03):
[2] Voids in BGAs
Prasad, Ray P.
SMT Surface Mount Technology Magazine, 2001, 15 (05):
[3] BGAs for MCMs
Marrs, Robert C.
Olachea, Gil
Advanced Packaging, 1994, 3 (05):
[4] Fujitsu ICs in BGAs
不详
MICROELECTRONICS JOURNAL, 1996, 27 (06) : R10 - R10
[5] Implementing BGAs
Brown, Scott
Circuits Assembly, 1996, 7 (04):
[6] Reballing reclaimed BGAs
Casey, William J.
Circuits Assembly, 1999, 10 (07):
[7] Mounting strategies for BGAs
Circuits Assembly, 1996, 7 (11):
[8] BGAs for high reliability applications
Electronic Packaging and Production, 1998, 38 (03):
[9] Thermal performance of underfilled BGAS
Elkady, YA
Knight, RW
Suhling, JC
Lall, P
ITHERM 2004, VOL 1, 2004, : 624 - 634
[10] Underfilling micro-BGAs
Peng, HW
Johnson, RW
Flowers, G
Yeager, E
Konarski, M
Torres, A
Crane, L
2000 HD INTERNATIONAL CONFERENCE ON HIGH-DENSITY INTERCONNECT AND SYSTEMS PACKAGING, 2000, 4217 : 134 - 140