Voiding in BGAs

被引:0
|
作者
Indium Corp of America, Utica, United States [1 ]
机构
来源
Soldering Surf Mount Technol | / 21卷 / 44-48期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
6
引用
收藏
相关论文
共 50 条
  • [21] Shock reliability of BGAs using underfill
    Hisert, Jim
    SMT Surface Mount Technology Magazine, 2007, 21 (01):
  • [22] Self-centering of BGAs and solder interconnects
    Electronic Packaging and Production, 1997, 37 (11):
  • [23] Investigation of underfilling BGAs packages - Thermal fatigue
    Pham, Van-Lai
    Xu, Jiefeng
    Pan, Ke
    Wang, Jing
    Park, Seungbae
    Singh, Charandeep
    Wang, Huayan
    2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 2252 - 2258
  • [24] BGAS POISED TO SOOTHE PCB MANUFACTURERS WOES
    DONLIN, M
    COMPUTER DESIGN, 1993, 32 (09): : 18 - 18
  • [25] Contract packaging: using BGAs to advance CSPs
    Hart, Curtis
    Advanced Packaging, 1999, 8 (01):
  • [26] Building reliability into full-array BGAs
    Li, Y
    Pannikkat, A
    Anderson, L
    Verma, T
    Euzent, B
    TWENTY SIXTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, PROCEEDINGS, 2000, : 146 - 152
  • [27] Flash memory goes smaller with BGAs
    Levy, M
    EDN, 1997, 42 (02) : 18 - 18
  • [28] Corner and edge bond dispensing for BGAs
    Lewis, Al
    Asymtek, A.
    SMT Surface Mount Technology Magazine, 2007, 21 (09):
  • [29] BGAS MAKE TRANSITION TO MEMORY PACKAGES
    MALINIAK, D
    ELECTRONIC DESIGN, 1993, 41 (21) : 34 - +
  • [30] A Guide to Infrared (IR) rework on bgas
    Gibbs, Roger
    SMT Surface Mount Technology Magazine, 2009, 23 (03):