Implementing BGAs

被引：0

作者：

Brown, Scott ^{[1
]}

机构：

[1] Accu-Tronics Inc, Raleigh, United States

来源：

Circuits Assembly | 1996年 / 7卷 / 04期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

共 50 条

[1] Implementing an effective solution for inspecting BGAs
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EE-EVALUATION ENGINEERING, 2000, 39 (10): : 100 - +
[2] Designing with BGAs
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Printed Circuit Design, 2002, 19 (03):
[3] Voids in BGAs
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SMT Surface Mount Technology Magazine, 2001, 15 (05):
[4] BGAs for MCMs
Marrs, Robert C.
Olachea, Gil
Advanced Packaging, 1994, 3 (05):
[5] Fujitsu ICs in BGAs
不详
MICROELECTRONICS JOURNAL, 1996, 27 (06) : R10 - R10
[6] Voiding in BGAs
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Soldering Surf Mount Technol, 21 (44-48):
[7] Reballing reclaimed BGAs
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Circuits Assembly, 1999, 10 (07):
[8] Mounting strategies for BGAs
Circuits Assembly, 1996, 7 (11):
[9] BGAs for high reliability applications
Electronic Packaging and Production, 1998, 38 (03):
[10] Thermal performance of underfilled BGAS
Elkady, YA
Knight, RW
Suhling, JC
Lall, P
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