Materials for multichip modules

被引：0

作者：

Sergent, Jerry E. ^{[1
]}

机构：

[1] BBS PowerMod, Victor, United States

来源：

Electronic Packaging and Production | 1996年 / 36卷 / 13期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

共 50 条

[11] MICROWAVE MULTICHIP MODULES
LEHTONEN, SJ
MOORE, CR
FRANCOMACARO, AS
EDWARDS, RL
CLATTERBAUGH, GV
JOHNS HOPKINS APL TECHNICAL DIGEST, 1994, 15 (01): : 48 - 56
[12] Wirebonding for multichip modules
Charles, HK
Mach, KJ
Edwards, RL
Lehtonen, SJ
1996 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1996, 2920 : 420 - 425
[13] Reworking multichip modules
Agroskin, S.
Geiger Jr., D.
Griswold, B.
Min, B.Y.
Reinschmidt, R.
Lasiter, J.
Mathews, P.B.
Chong, F.C.
Electronic Packaging and Production, 1995, 35 (03): : 42 - 45
[14] PROGRAMMABLE MULTICHIP MODULES
BURMAN, S
SHERWANI, NA
IEEE MICRO, 1993, 13 (02) : 28 - 35
[15] DESIGN OF MULTICHIP MODULES
SCHAPER, LW
PROCEEDINGS OF THE IEEE, 1992, 80 (12) : 1955 - 1964
[16] MULTICHIP MODULES - INTRODUCTION
DAI, WWM
CHENG, KT
IEEE DESIGN & TEST OF COMPUTERS, 1993, 10 (04): : 7 - 7
[17] TESTING MULTICHIP MODULES
FLINT, A
IEEE SPECTRUM, 1994, 31 (03) : 59 - 62
[18] AN OVERVIEW OF MULTICHIP MODULES
LALL, P
BHAGATH, S
SOLID STATE TECHNOLOGY, 1993, 36 (09) : 65 - &
[19] THE FUTURE FOR MULTICHIP MODULES
SAGE, MG
MICROELECTRONIC ENGINEERING, 1992, 19 (1-4) : 517 - 518
[20] FLUOROPOLYMER COMPOSITE MULTICHIP MODULES
LOCKARD, SC
SEVENTH IEEE/CHMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM: INTEGRATION OF THE MANUFACTURING FLOW - FROM RAW MATERIAL THROUGH SYSTEMS-LEVEL ASSEMBLY, 1989, : 110 - 110