Barrier behaviour of TiW between copper and aluminium

被引：0
|
作者：
Krautz, H. [1 ]
Wenzel, Ch. [1 ]
Bornkessel, K. [1 ]
Blasek, G. [1 ]
机构：
[1] Technische Univ Dresden, Germany
来源：
Physica Status Solidi (A) Applied Research | 1988年 / 110卷 / 02期
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D O I：
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摘要：
Integrated Circuits, VLSI
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