共 50 条
- [41] Incorporating BGAs into high volume assembly operations Electronic Packaging and Production, 1997, 37 (11): : 46 - 50
- [42] Cost effective approach to fine pitch BGAs 1997 INTERNATIONAL CONFERENCE ON MULTICHIP MODULES - PROCEEDINGS, 1997, : 154 - 159
- [43] Accessing Adhesive Induced Risk for BGAs in Temperature Cycling 2014 IEEE 64TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014, : 395 - 403
- [44] Laser Soldering of Small Pitch BGAs on Plexiglas Substrate PCBs 2009 32ND INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2009, : 218 - +
- [45] Reducing substrate size using lower I/O BGAs Electronic Packaging and Production, 1997, 37 (07):
- [46] IDENTICAL MODEL MOUNTING WITHOUT TRADITIONAL MOUNTING PLATES DEUTSCHE ZAHNARZTLICHE ZEITSCHRIFT, 1985, 40 (03): : 341 - 343
- [47] Failure analysis and stress simulation in small multichip BGAs IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2001, 24 (02): : 216 - 223
- [48] Interfacial Reaction of Reballed BGAs under Isothermal Aging Conditions 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 557 - +