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- [21] Comparison of electrical performance of enhanced BGAs 47TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 1997 PROCEEDINGS, 1997, : 682 - 688
- [22] Shock reliability of BGAs using underfill SMT Surface Mount Technology Magazine, 2007, 21 (01):
- [23] Mounting Tensions: Materializing Strategies and Tactics on National Park "Social Trails" ENVIRONMENTAL COMMUNICATION-A JOURNAL OF NATURE AND CULTURE, 2016, 10 (04): : 418 - 431
- [24] Self-centering of BGAs and solder interconnects Electronic Packaging and Production, 1997, 37 (11):
- [25] Investigation of underfilling BGAs packages - Thermal fatigue 2020 IEEE 70TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2020), 2020, : 2252 - 2258
- [26] Light Sheet Microscopy Imaging and Mounting Strategies for Early Zebrafish Embryos JOVE-JOURNAL OF VISUALIZED EXPERIMENTS, 2024, (209):
- [29] Building reliability into full-array BGAs TWENTY SIXTH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, PROCEEDINGS, 2000, : 146 - 152